Through Substrate Conductors
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United States of America Patent
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app pub date -
Sep 23, 2008
filing date -
Sep 23, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Structures and methods of forming through substrate vias are disclosed. In one embodiment, the method includes forming a through substrate opening from a top surface of a substrate, the top surface including active devices, and filling the first through substrate opening with an ancillary material. A conductive capping layer is formed over the ancillary material to cap the first through substrate opening. The substrate is thinned from a back surface to expose a portion of the ancillary material, the back surface being opposite to the top surface. The ancillary material is removed from the first through substrate opening, and a conductor is formed by filling a conductive material into the through substrate opening.
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