Die pickup method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

12592624

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A die push-up apparatus using a vertically movable die pick-up member 22 for die-peeling, the die pick-up member 22 which pushes dies upward being disposed inside a suction holding stage 10 further toward a die feeding direction side than a die push-up member 21 for die-pickup. With the die push-up member 22 lowered, the forward end portion (with respect to the die feeding direction) of a die 1A that is to be picked up is moved to above the die push-up member 22, the die push-up member 22 is next raised so that the forward end portion of the die 1A passing thereon is peeled from the wafer sheet 2; and further with the die push-up member 22 raised, the die 1A is fed to the pickup center 5 and is picked up by a collet 4 and the rising die push-up member 21.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA SHINKAWA2-51-1 INADAIRA MUSASHIMURAYAMA TOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujisawa, Kazuhiro Nishitokyo-shi, JP 22 278
Odaka, Yutaka Akiruno-shi, JP 4 10

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