Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonder
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United States of America Patent
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Issued Date -
Apr 1, 2010
app pub date -
Oct 1, 2008
filing date -
Oct 1, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and a program (recorded on a recording medium) for securing a curved circuit board in a flat fashion on (a film application stage and) a bonding stage of a die bonder provided with suction cavities formed in a substrate suction surface of the bonding stage that suctions the curved circuit board, including the steps of evacuating air from the vacuum suction cavities using a vacuum device, and moving a die collet provided at a tip end of a bonding arm to press the circuit board down and thus sealing at least one of the vacuum suction cavities by the circuit board so as to allow the remaining vacuum suction cavities to be sealed successively by the flattened circuit board, thereby sealing the upper surfaces of all the vacuum suction cavities by the flattened circuit board, so that the circuit board is suction-held and secured on the bonding stage.
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