INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESS
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United States of America Patent
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Issued Date -
Apr 1, 2010
app pub date -
Sep 26, 2008
filing date -
Sep 26, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit package system includes: providing a die attach pad; forming a package contact pad adjacent the die attach pad; attaching an integrated circuit over the die attach pad; attaching a die connector to the integrated circuit and the package contact pad; and forming an encapsulant over the die connector and the integrated circuit, the encapsulant having an encapsulant edge from a sawless singulation process.
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