COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAINED USING THE SAME
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United States of America Patent
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Issued Date -
Apr 8, 2010
app pub date -
Mar 5, 2008
filing date -
Mar 15, 2007
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Abandoned
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Abstract
To provide a two-layer flexible substrate having excellent folding endurance, etching properties, and resist adhesiveness with no surface defects.A copper electrolytic solution containing chloride ions, a sulfur organic compound and polyethylene glycol as additives, and the copper electrolytic solution preferably contains 5 to 200 ppm of chloride ions, 2 to 1000 ppm of a sulfur organic compound and 5 to 1500 ppm of polyethylene glycol. A two-layer flexible substrate having a copper layer formed using the copper electrolytic solution, wherein the MIT folding endurance is 100 or more, and the surface roughness (Rz) of the copper layer is 1.4 to 3.0 μm.
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