DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME

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United States of America Patent

SERIAL NO

12488137

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Abstract

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Structured and Methods for integrating MEMS devices into low-cost organic chip-scale packages, using sealed cavities, are provided.

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Patent Owner(s)

Patent OwnerAddress
HAWAT NOUREDDINENot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hawat, Noureddine Woburn, US 5 39
Nuytkens, Peter R Melrose, US 26 494

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