MICROENCAPSULATION OF A PHASE CHANGE MATERIAL WITH ENHANCED FLAME RESISTANCE
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United States of America Patent
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Issued Date -
Apr 8, 2010
app pub date -
Oct 8, 2009
filing date -
Oct 8, 2008
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Abandoned
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Abstract
A flame-resistant microcapsule that comprises a core comprising a phase change material and a wall material encapsulating the core. The microcapsules includes at least one of: a flame retardant applied to the wall material and a phase change material having a boiling point of about 230° C. to about 420° C. to provided enhanced flame resistance. The phase change material may have a boiling point of about 280° C. to about 400° C. or about 300° C. to about 390° C.
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