Method for Structuring a Layered Stack

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100099253A1
SERIAL NO

12253061

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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One implementation is a method for fabricating a semiconductor on a substrate. A first layer is formed on the substrate. An implanted pattern is introduced into the first layer by implanting using a structured implantation mask arranged over the first layer. A structured second layer is formed on the first layer after removing the implantation mask. A first pattern is generated in the substrate using the second layer as a mask. The first layer is developed with regard to the implanted pattern. A second pattern is generated in the substrate using the first layer as a mask.

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Patent Owner(s)

Patent OwnerAddress
QIMONDA AGGUSTAV-HEINEMANN-RING 212 MUNICH 81739

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baier, Ulrich Dresden, DE 7 25
Beck, Michael Dresden, DE 84 749
Cigal, Jean Charles Dresden, DE 3 20
Czech, Guenther Langebrueck, DE 3 16
Lahnor, Peter Dresden, DE 16 95
Petri, Marc Moritzburg OT Auer, DE 1 1
Weber, Detlef Ottendorf-Okrilla, DE 18 56

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