ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESS
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United States of America Patent
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Issued Date -
May 6, 2010
app pub date -
Nov 2, 2009
filing date -
Nov 5, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.
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