PRESSURE SENSOR AND WIRE GUIDE ASSEMBLY
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United States of America Patent
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Issued Date -
May 6, 2010
app pub date -
Oct 30, 2008
filing date -
Oct 30, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A pressure sensor chip is described. The pressure sensor chip include a substrate, a polycrystalline silicon layer, at least one silicon layer, and a diaphragm movement element. The polycrystalline silicon layer is formed on the substrate and has a cavity recess formed therein. The at least one silicon layer is formed on the polycrystalline silicon layer and covers the cavity recess thereby forming a reference chamber with a diaphragm. The diaphragm movement element is configured to sense movement of the diaphragm. An assembly incorporating the pressure sensor chip and a method of forming the pressure sensor chip are also described.
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