BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE
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United States of America Patent
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app pub date -
Nov 4, 2008
filing date -
Nov 4, 2008
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Abstract
The present invention provides a semiconductor device package, comprising a die having a back surface and an active surface formed thereon; a conductive layer formed upon the back surface of the die; and a protection substrate formed on the conductive layer. An adhesive layer is formed between the conductive layer and the protective layer, if necessary. The present invention further provides a method for forming a semiconductor device package, comprising providing a plurality of die having a back surface and an active surface on a wafer; forming a conductive layer upon the back surface of the die; forming protection substrates on the conductive layer; forming a plurality of bumps on the active surface of each die; and dicing the plurality of die into individual die for singulation by exerting external force on the substrate. An adhesive layer is formed between the conductive layer and the protective layer, if necessary.
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