SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
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United States of America Patent
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N/A
Issued Date -
May 6, 2010
app pub date -
Apr 28, 2009
filing date -
Apr 29, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A stiffener is provided for use in making semiconductor devices. The stiffener and method of use provided prevent or reduce warpage of a semiconductor package during the assembly process. More particularly, the stiffener functions to prevent or reduce warpage during molding of an assembly of wafers and/or dies. The stiffener may be positioned above the backside or non-active side of an assembly of wafer and/or dies during molding. The presence of the stiffener prevents or reduces warpage caused by CTE mismatch between the mold material and the wafer and/or under the high temperatures encountered in the process of molding. After molding, the stiffener may continue to provide support to the assembly.
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