PROBE CARD, NEEDLES OF PROBE CARD, AND METHOD OF MANUFACTURING THE NEEDLES OF PROBE CARD

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United States of America Patent

APP PUB NO 20100109697A1
SERIAL NO

12595771

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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can elastically contact the pad of a wafer die. Here, the beam portion has undergone a plating process. The needle of a probe card can precisely contact the pad.

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Patent Owner(s)

Patent OwnerAddress
IM CO LTDGYEONGGI-DO 445-170

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oh, Joon-Seok Cheongju-si, KR 7 8

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