METAMATERIAL STRUCTURES WITH MULTILAYER METALLIZATION AND VIA

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United States of America Patent

SERIAL NO

12270410

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Abstract

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Techniques and apparatus based on metamaterial structures are provided for antenna and transmission line devices, including multilayer metallization metamaterial structures with one or more conductive vias connecting conductive parts in two different metallization layers.

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Patent Owner(s)

  • TYCO ELECTRONICS SERVICES GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Achour, Maha 4215 Camino Sandoval 125 4613
Gummalla, Ajay 10710 Aderman Ave, #141 49 3706
Lopez, Norberto 11247 Avenida de los Lobos, Unit B 9 480
Nguyen, Nhan 4833 Seascape Drive 27 956
Poilasne, Gregory 2097 Valley View Boulevard 77 4238
Thornwall, Shane 9775 Mesa Springs Way, Apt. 105 6 150

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