SURFACE PROCESSING METHOD AND MANUFACTURING METHOD OF RECORDING MEDIUM
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United States of America Patent
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Issued Date -
May 13, 2010
app pub date -
Mar 27, 2007
filing date -
Mar 27, 2007
priority date (Note) -
Abandoned
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Abstract
A surface processing method of processing a surface of a substrate includes disposing the substrate in a vacuum chamber, processing by applying a high-frequency voltage to the substrate and by sputtering the surface of the substrate, measuring a cathode drop potential generated at the substrate in the processing and obtaining a time integration value of the cathode drop potential, and determining whether or not a processed state of the surface of the substrate is good based on the time integration value obtained in the measuring.
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