US Patent Application No: 2010/0119,144

Number of patents in Portfolio can not be more than 2000

METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA

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Abstract

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Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KLA-TENCOR TECHNOLOGIES CORPORATIONMILPITAS, CA736

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duffy, Brian San Jose, US 20 163
Kulkarni, Ashok San Jose, US 19 318
Maayah, Kais Cupertino, US 6 93
Rouse, Gordon Dublin, US 4 89

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Patent Info (Count) # Cites Year
 
SCREEN HOLDINGS CO., LTD. (1)
* 2013/0057,552 DRAWING APPARATUS AND DRAWING METHOD 0 2012
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
* 8,515,724 Technology computer-aided design (TCAD)-based virtual fabrication 0 2010
8,539,421 Layout-specific classification and prioritization of recommended rules violations 0 2011
* 8,849,440 Manufacturing control based on a final design structure incorporating both layout and client-specific manufacturing information 0 2012
* 8,548,788 Technology computer-aided design (TCAD)-based virtual fabrication 0 2012
 
HITACHI HIGH-TECHNOLOGIES CORPORATION (3)
* 8,767,038 Method and device for synthesizing panorama image using scanning charged-particle microscope 0 2009
* 8,953,868 Defect inspection method and defect inspection apparatus 0 2013
* 2013/0322,737 DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS 0 2013
 
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION (1)
* 8,312,395 Automatic identification of systematic repeating defects in semiconductor production 0 2011
 
ELITETECH TECHNOLOGY CO.,LTD. (2)
* 8,312,401 Method for smart defect screen and sample 0 2011
* 2012/0185,818 METHOD FOR SMART DEFECT SCREEN AND SAMPLE 1 2011
 
Cadence Design Systems, Inc. (4)
8,209,656 Pattern decomposition method 12 2008
* 8,151,219 System and method for multi-exposure pattern decomposition 6 2010
8,516,402 Method and apparatus for automatically fixing double patterning loop violations 7 2011
8,473,874 Method and apparatus for automatically fixing double patterning loop violations 6 2011
 
MENTOR GRAPHICS CORPORATION (2)
* 8,930,782 Root cause distribution determination based on layout aware scan diagnosis results 0 2012
* 2012/0297,264 Root Cause Distribution Determination Based On Layout Aware Scan Diagnosis Results 2 2012
 
APPLIED MATERIALS, INC. (2)
* 8,527,081 Method and apparatus for automated validation of semiconductor process recipes 0 2011
* 2012/0053,719 METHOD AND APPARATUS FOR AUTOMATED VALIDATION OF SEMICONDUCTOR PROCESS RECIPES 0 2011
 
APPLIED MATERIALS ISRAEL, LTD. (3)
* 8,254,661 System and method for generating spatial signatures 1 2009
* 2013/0163,851 SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR CLASSIFICATION WITHIN INSPECTION IMAGES 1 2011
8,553,970 System and method for generating spatial signatures 0 2012
 
KLA-TENCOR CORPORATION (3)
* 8,718,353 Reticle defect inspection with systematic defect filter 0 2012
* 9,087,367 Determining design coordinates for wafer defects 0 2012
* 2014/0205,179 RETICLE DEFECT INSPECTION WITH SYSTEMATIC DEFECT FILTER 0 2014
 
Hermes-Microvision, Inc. (1)
* 2012/0314,054 METHOD AND MACHINE FOR EXAMINING WAFERS 0 2012
* Cited By Examiner