Polishing method and polishing apparatus
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United States of America Patent
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app pub date -
Oct 29, 2009
filing date -
Sep 15, 2006
priority date (Note) -
Abandoned
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Abstract
An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production. is provided.
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