INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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app pub date -
Nov 20, 2008
filing date -
Nov 20, 2008
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a first terminal having a cavity; mounting a first integrated circuit over the first terminal and connected in the cavity; forming a second terminal adjacent to the first terminal; connecting a second integrated circuit, over the first integrated circuit, and the second terminal; and forming a first encapsulation over the first integrated circuit with the first terminal exposed.
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