METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING
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United States of America Patent
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Issued Date -
May 27, 2010
app pub date -
Dec 24, 2008
filing date -
Nov 25, 2008
priority date (Note) -
Abandoned
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Abstract
A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a top outlet located in top position with respect to a work piece for applying fluid during sawing, and a chute located substantially below the work piece for receiving the fluid, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluid moves in a vertical direction against and into the work piece. The wire sawing apparatus further includes a frame for holding the horizontal ingot feeding wire slicing apparatus, and a control panel for operating the wire sawing apparatus.
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