Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels

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United States of America Patent

APP PUB NO 20100126961A1
SERIAL NO

12596921

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Abstract

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A highly aqueous, strongly basic planarizing solution and a process for its use to reducing or essentially eliminating protrusions or projections extending generally upwardly from a generally planar surface of polysilicon film produced by Low Temperature Poly Si (LTPS) annealing a film of amorphous silicon deposited on a substrate; the process including contacting the surface of the generally planar polysilicon film with the highly aqueous, strongly basic solution for a time sufficient to selectively etch the protrusions or projections from the surface of the generally planar polysilicon film without any significant etching of the generally planar polysilicon film, said highly aqueous, strongly basic solution being a solution having a pH of 12 or higher and comprising water, at least one strong base, and at least one etch rate control agent.

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Patent Owner(s)

Patent OwnerAddress
AVANTOR PERFORMANCE MATERIALS INC222 RED SCHOOL LANE PHILLIPSBURG NJ 08865

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Seong Jin Chungcheongbuk-do, KR 6 53
Kim, Sang In Giheung-gu Yongin City, KR 8 42

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