INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Jun 3, 2010
app pub date -
Dec 3, 2008
filing date -
Dec 3, 2008
priority date (Note) -
Abandoned
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having a first side and a second side with the first side having a device contact and an interconnect contact and with the second side having a test pad; mounting an integrated circuit over the device contact; and applying an underfill between the integrated circuit and the interposer.
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