Electrochemically Fabricated Microprobes
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United States of America Patent
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Issued Date -
Jun 3, 2010
app pub date -
Nov 24, 2009
filing date -
Feb 4, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
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