SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

SERIAL NO

12698862

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Abstract

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A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.

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Patent Owner(s)

Patent OwnerAddress
SCREEN SEMICONDUCTOR SOLUTIONS CO LTDKYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asano, Toru Kyoto, JP 44 734
Kanaoka, Masashi Kyoto, JP 36 488
Kaneyama, Koji Kyoto, JP 69 700
Mitsuhashi, Tsuyoshi Kyoto, JP 52 755
Miyagi, Tadashi Kyoto, JP 53 754
Okumura, Tsuyoshi Kyoto, JP 52 514
Shigemori, Kazuhito Kyoto, JP 39 562
Taguchi, Takashi Kyoto, JP 43 544
Toriyama, Yukio Kyoto, JP 9 97
Yasuda, Shuichi Kyoto, JP 74 906

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