MICROPOROUS LAYER FOR LOWERING FRICTION IN METAL-FORMING PROCESSES
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United States of America Patent
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Issued Date -
Jun 3, 2010
app pub date -
Jun 20, 2008
filing date -
Jun 21, 2007
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Abandoned
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Abstract
The invention is a microporous layer to be used in metal forming processes providing lower friction and improved resistance against galling. The layer is a thin, porous metallic film, which is electrochemically deposited on a metallic substrate, whereafter one of the metals of the deposited film is selectively removed by chemical etching, thereby leaving a micro- or even nanoporous layer on the surface of the substrate, which enhances lubricant entrapment leading to improved lubrication during metal forming processes.
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