Method for processing a memory link with a set of at least two laser pulses
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United States of America Patent
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Dec 25, 2012
Grant Date -
Jun 10, 2010
app pub date -
Feb 12, 2010
filing date -
Jan 10, 2000
priority date (Note) -
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Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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