Plated Resin Molded Article

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United States of America Patent

APP PUB NO 20100143730A1
SERIAL NO

12308609

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a plated resin molded article having high heat resistance and plating adhesive strength, and further having beautiful appearance. Specifically it provides the plated resin molded article having a metallic plating layer on the surface thereof, composed of: a resin composition containing (A) a synthetic resin, (B) a water-soluble substance having a solubility in water (at 25° C.) ranging from 0.01/100 g to 10 g/100 g, and (C) a polymer having a maleimide-based monomer unit, wherein the resin molded article is not treated by etching by an acid containing chromium and/or manganese.

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Patent Owner(s)

Patent OwnerAddress
DAICEL POLYMER LTDTOKYO 108-8231

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tai, Toshihiro Hyogo, JP 12 25

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