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United States of America Patent
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Issued Date -
Jun 17, 2010
app pub date -
Dec 16, 2008
filing date -
Dec 16, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a package comprising a plate formed from a diamond-composite material and a frame and its use as a lid or cavity lid in electronic packaging applications.
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