PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 24, 2010
app pub date -
May 16, 2008
filing date -
May 22, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully