POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Jun 24, 2010
app pub date -
Jul 24, 2008
filing date -
Jul 24, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An object of one embodiment of the present invention is to provide a polishing composition that can achieve high polishing rate and as well can improve flatness. A polishing composition of an embodiment of the invention is a polishing composition suitable for a metal film, in particular, a copper film, and contains a basic compound containing an ammonium group, alkylbenzene sulfonate having an alkyl group with carbon number of from 9 to 18, and hydrogen peroxide, the remainder being water. Ammonium hydroxide can be used as the basic compound, and dodecylbenzene sulfonate or the like can be used as the alykbenzene sulfonate.
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