US Patent Application No: 2010/0159,691

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PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE

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Abstract

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Disclosed is a photosensitive resin composition showing excellent contrast performance after exposure to light. Also disclosed is a photosensitive resin laminate using the composition. The photosensitive resin composition comprises (a) 20 to 90% by mass of a binder having a carboxyl group, (b) 5 to 75% by mass of an addition-polymerizable monomer having at least one ethylenically unsaturated terminal group, (c) 0.01 to 30% by mass of a photopolymerization initiator, and (d) 0.01 to 10% by mass of a leuco dye, wherein a specific binder is contained as the binder (a) and a specific monomer is contained as the addition-polymerizable monomer (b).

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ASAHI KASEI EMD CORPORATIONTOKYO65

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsutsui, Yamato - 1 2

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
3M INNOVATIVE PROPERTIES COMPANY (1)
8,178,873 Solution processable organic semiconductors 0 2008
 
HITACHI CHEMICAL COMPANY, LTD. (1)
8,586,284 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board 0 2008