US Patent Application No: 2010/0159,691

Number of patents in Portfolio can not be more than 2000

PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a photosensitive resin composition showing excellent contrast performance after exposure to light. Also disclosed is a photosensitive resin laminate using the composition. The photosensitive resin composition comprises (a) 20 to 90% by mass of a binder having a carboxyl group, (b) 5 to 75% by mass of an addition-polymerizable monomer having at least one ethylenically unsaturated terminal group, (c) 0.01 to 30% by mass of a photopolymerization initiator, and (d) 0.01 to 10% by mass of a leuco dye, wherein a specific binder is contained as the binder (a) and a specific monomer is contained as the addition-polymerizable monomer (b).

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ASAHI KASEI EMD CORPORATIONTOKYO58

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsutsui, Yamato Tokyo, JP 1 2

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FUJIFILM CORPORATION (1)
* 2008/0113,302 Pattern Forming Process 3 2005
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
* 2002/0064,728 Near IR sensitive photoimageable/photopolymerizable compositions, media, and associated processes 8 2001
 
FUJI PHOTO FILM CO., LTD. (1)
* 2005/0025,946 Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer 1 2004
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
3M INNOVATIVE PROPERTIES COMPANY (2)
* 8,178,873 Solution processable organic semiconductors 0 2008
* 2010/0270,542 Solution Processable Organic Semiconductors 4 2008
 
HITACHI CHEMICAL COMPANY, LTD. (2)
* 8,586,284 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board 0 2008
* 2011/0086,309 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD 0 2008
* Cited By Examiner