PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE
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United States of America Patent
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Issued Date -
Jun 24, 2010
app pub date -
Jul 27, 2007
filing date -
Aug 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is a photosensitive resin composition showing excellent contrast performance after exposure to light. Also disclosed is a photosensitive resin laminate using the composition. The photosensitive resin composition comprises (a) 20 to 90% by mass of a binder having a carboxyl group, (b) 5 to 75% by mass of an addition-polymerizable monomer having at least one ethylenically unsaturated terminal group, (c) 0.01 to 30% by mass of a photopolymerization initiator, and (d) 0.01 to 10% by mass of a leuco dye, wherein a specific binder is contained as the binder (a) and a specific monomer is contained as the addition-polymerizable monomer (b).
First Claim
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International Classification(s)
- B24C:ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATE....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- G03C:PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
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