Methods to recover and purify silicon particles from saw kerf
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United States of America Patent
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Jul 31, 2012
Grant Date -
Jul 1, 2010
app pub date -
Dec 28, 2009
filing date -
Dec 31, 2008
priority date (Note) -
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Abstract
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
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