POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Jul 1, 2010
app pub date -
Jun 9, 2008
filing date -
Jun 8, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows non-selectivity, while being sufficiently suppressed in dishing and erosion.
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