CHIP PACKAGE WITH STACKED INDUCTORS
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United States of America Patent
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Issued Date -
Jul 1, 2010
app pub date -
Apr 24, 2009
filing date -
Dec 25, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor chip package with inductors includes a substrate, a semiconductor chip, an inductor and an insulator cover. The substrate has an active surface with a patterned circuit thereon. The inductor disposes on the active surface of the substrate. The semiconductor chip stacks over the inductor and electrically interconnects with the patterned circuit of the substrate and the inductor. The insulator cover encapsulates the inductor and the chip.
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