IC PACKAGE HAVING COLORED PATTERN
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United States of America Patent
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N/A
Issued Date -
Jul 15, 2010
app pub date -
Apr 17, 2009
filing date -
Jan 15, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An IC package having a colored pattern includes a substrate, a chip electrically connected with the substrate, an insulating cover layer covering the chip, and a colored-pattern layer disposed on the insulating cover layer by ink jet printing or an alternative.
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