PROBING APPARATUS WITH TEMPERATURE-ADJUSTING MODULES FOR TESTING SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Jul 22, 2010
app pub date -
Apr 3, 2009
filing date -
Jan 16, 2009
priority date (Note) -
Abandoned
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Abstract
A probing apparatus for testing semiconductor devices comprises an upper guiding plate having a plurality of upper guiding holes, a bottom guiding plate having a plurality of bottom guiding holes, a plurality of vertical probes disposed between the upper guiding holes of the upper guiding plate and the bottom guiding holes of the bottom guiding plate, and a temperature-adjusting module including at least one flow line configured to direct a fluid into a space between the upper guiding plate and the bottom guiding plate.
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