US Patent Application No: 2010/0183,181

Number of patents in Portfolio can not be more than 2000

MINIATURE MEMS CONDENSER MICROPHONE PACKAGES AND FABRICATION METHOD THEREOF

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NEOMEMS TECHNOLOGIES, INC., WUXI, CHINAWUXI JIANGSU PROVINCE, CN5

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Yunlong Sunnyvale, US 20 159

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 6,870,937 Electroacoustic transducer, process of producing the same and electroacoustic transducing device using the same 16 2000
 
CYPRESS SEMICONDUCTOR CORPORATION (1)
* 7,409,616 Built in self test system and method for detecting and correcting cycle slip within a deserializer 8 2004
 
The Charles Stark Draper Laboratory, Inc. (2)
* 5,146,435 Acoustic transducer 163 1989
* 5,452,268 Acoustic transducer with improved low frequency response 176 1994
 
The Board of Trustees of the Leland Stanford Junior University (3)
* 5,619,476 Electrostatic ultrasonic transducer 87 1994
* 5,894,452 Microfabricated ultrasonic immersion transducer 92 1996
* 6,493,288 Wide frequency band micromachined capacitive microphone/hydrophone and method 17 2000
 
KNOWLES ELECTRONICS, LLC (4)
* 6,535,460 Miniature broadband acoustic transducer 92 2001
* 6,781,231 Microelectromechanical system package with environmental and interference shield 205 2002
* 7,434,305 Method of manufacturing a microphone 72 2004
* 2005/0018,864 Silicon condenser microphone and manufacturing method 46 2004
 
EPCOS AG (1)
* 7,466,834 Electret condenser microphone 21 2005
 
The United States of America as represented by the Secretary of the Navy (1)
* 5,870,351 Broadband microfabriated ultrasonic transducer and method of fabrication 100 1996
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INVENSENSE, INC. (1)
8,841,738 MEMS microphone system for harsh environments 3 2012
 
NEOMEMS TECHNOLOGIES, INC., WUXI, CHINA (1)
* 8,571,249 Silicon microphone package 2 2010
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 2012/0313,190 PACKAGED DEVICE INCLUDING INTERPOSER FOR INCREASED ADHESIVE THICKNESS AND METHOD OF ATTACHING DIE TO SUBSTRATE 2 2011
 
ROBERT BOSCH GMBH (2)
8,948,420 MEMS microphone 0 2011
9,319,799 Microphone package with integrated substrate 0 2013
 
KNOWLES ELECTRONICS, LLC (1)
9,301,075 MEMS microphone with out-gassing openings and method of manufacturing the same 0 2014
 
INFINEON TECHNOLOGIES AG (4)
* 8,130,506 Sensor module 0 2008
* 2009/0313,817 SENSOR MODULE 0 2008
* 9,177,879 Sensor module 0 2012
* 2012/0162,948 SENSOR MODULE 0 2012
* Cited By Examiner