US Patent Application No: 2010/0183,181

Number of patents in Portfolio can not be more than 2000

MINIATURE MEMS CONDENSER MICROPHONE PACKAGES AND FABRICATION METHOD THEREOF

ALSO PUBLISHED AS: 8325951

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Abstract

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MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
GENERAL MEMS CORPORATIONSUNNYVALE, CA7

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Yunlong Fremont, CA 27 95

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
GENERAL MEMS CORPORATION (1)
8,571,249 Silicon microphone package 1 2010
 
INFINEON TECHNOLOGIES AG (1)
8,130,506 Sensor module 0 2008
 
INVENSENSE, INC. (1)
8,841,738 MEMS microphone system for harsh environments 0 2012