STRIPPING AGENT FOR RESIST FILM ON/ABOVE CONDUCTIVE POLYMER, METHOD FOR STRIPPING RESIST FILM, AND SUBSTRATE HAVING PATTERNED CONDUCTIVE POLYMER
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United States of America Patent
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Issued Date -
Jul 22, 2010
app pub date -
May 27, 2008
filing date -
Jun 12, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The object of the present invention is to provide a stripping agent that not only has excellent stripping properties but also does not adversely affect a conductive polymer when a resist film is stripped from the conductive polymer, and a method for stripping a resist film on/above a conductive polymer. Furthermore, the object is to provide a substrate having a patterned conductive polymer that has good conductivity.The stripping agent for a resist film on/above a conductive polymer of the present invention includes at least one organic solvent selected from the group consisting of an aprotic organic solvent (a) that is selected from the group consisting of a dialkylsulfone, a dialkyl sulfoxide, an alkylene carbonate, and an alkyrolactone and does not have a nitrogen atom and an organic solvent (b) that has a nitrogen atom in the chemical structure and is one other than a primary amine compound, a secondary amine compound, and an organic quaternary ammonium salt.
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