Bonded Microelectromechanical Assemblies
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United States of America Patent
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N/A
Issued Date -
Jul 29, 2010
app pub date -
Jan 28, 2009
filing date -
Jan 28, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.
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