Blister Packaging Multilayer Resin Film and Blister Package
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United States of America Patent
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Issued Date -
Jul 29, 2010
app pub date -
Jun 13, 2008
filing date -
Jun 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A blister packaging multilayer resin film is used to produce a blister package in which an item is sealed between a support substrate and the multilayer resin film, wherein the multilayer resin film includes an oxygen barrier layer that is arranged on a side of the multilayer resin film which side faces the support substrate, and a moisture proof layer that is arranged on a side of the oxygen barrier layer which side does not face the support substrate.
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