Chemical Mechanical Polishing Composition
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United States of America Patent
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Issued Date -
Aug 5, 2010
app pub date -
Aug 5, 2008
filing date -
Aug 5, 2008
priority date (Note) -
Abandoned
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Abstract
An inhibitor composition according to the present invention at least comprises an imidazoline compound or a triazole compound or combinations thereof, and sarcosine and salt compounds thereof or combinations thereof. The inhibitor composition is applicable to chemical mechanical polishing so as to maintain a high removal rate of metal layers as well as suppress metal etching, thereby reducing polishing defects such as dishing, erosion and the like.
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