THREE DIMENSIONAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRICAL CUTOFF METHOD FOR USING FUSE PATTERN OF THE SAME
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United States of America Patent
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Issued Date -
Aug 5, 2010
app pub date -
Jul 30, 2008
filing date -
Jul 23, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a three-dimensional semiconductor device. The three-dimensional semiconductor device includes a body in which a plurality of semiconductor chips or packages are stacked, a protective substrate configured to protect an outer layer chip or package of the body and configured to transmit a laser beam, and a fuse pattern portion having a pattern of a fuse function formed to cut off an electrical connection of a defective chip or package by the laser beam penetrating the protective substrate when at least one of the chips or packages is defective.
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