System for printing 3D semiconductor products
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United States of America Patent
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-
Jan 3, 2012
Grant Date -
Aug 12, 2010
app pub date -
Apr 22, 2010
filing date -
Jan 16, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A system for printing three-dimensional semiconductor products. The system includes printheads for printing various so as to create a three-dimensional structure including cavities, and a robot for incorporating semiconductor objects into the cavities created during the printing process. The robot incorporates the semiconductor objects into the cavities during printing of the three-dimensional structure.
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