SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

United States of America Patent

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Issued Date
Aug 12, 2010
app pub date
Dec 18, 2009
filing date
Feb 9, 2009

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Abandoned

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Abstract

In a method of manufacturing a semiconductor package, a chip is disposed on a carrier. An inert gas is run around one end of a line portion of a copper bonding wire while the end is being formed into a spherical portion. The spherical portion is bonded to a pad of the chip. The chip and the copper bonding wire are sealed and the carrier is covered by a molding compound.

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Patent Owner(s)

Patent Owner	Address
GM GLOBAL TECHNOLOGY OPERATIONS INC	300 RENAISSANCE CENTER MC 482-C23-B21 DETROIT MI 48265-3000
PACIFIC CENTURY MOTORS INC	NO 2 JING YUAN NORTH STREET BDA BEIJING

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hsu, Cheng Tsung	Pingtung County, TW	3	176
HUANG, Wen Pin	Tainan City, TW	4	89
Hung, Chih Cheng	Kaohsiung City, TW	3	176
Tseng, Cheng Lan	Kaohsiung City, TW	2	65

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12642081

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SERIAL NO	12642081
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12642081

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