SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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app pub date -
Apr 20, 2010
filing date -
Mar 23, 2005
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Abandoned
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Abstract
A semiconductor device including a semiconductor device, an integrated circuit chip, a sealing resin encapsulating the integrated circuit chip and an insulating waterproof film covering at least a portion of a surface of said sealing resin and preventing penetration of moisture into the sealing resin.
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