Assembled configuration of cooling fins and heat pipes

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100212868A1
SERIAL NO

12071163

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An assembled configuration of cooling fins and heat pipes facilitates filling of a thermal interface material between contact surfaces of the cooling fins and the heat pipes and enhances stability of the cooling fins. The configuration is characterized in that each of the juxtaposed cooling fins is formed at an end thereof contacting the heat pipes with a bent portion having at least two sections so as to define an accommodating space for the thermal interface material and an extending section, wherein the accommodating space can be sufficiently filled with the thermal interface material and the extending section can be nestingly overlapped by an adjacent cooling fin, so as to effectively prevent the thermal interface material from leaking out and enhance stability of the assembled cooling fins.

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Patent Owner(s)

Patent OwnerAddress
SUPER MICRO COMPUTER INC980 ROCK AVENUE SAN JOSE CA 95131
YANG CHIEN-LUNG980 ROCK AVENUE SAN JOSE CA 95131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yang, Chien-Lung San Jose, US 3 11

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