FILLER FOR SUBSTRATE AND COMPOSITION FOR USE AS MATERIAL FOR INORGANIC/ORGANIC COMPOSITE SUBSTRATE FORMATION
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United States of America Patent
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Issued Date -
Sep 2, 2010
app pub date -
Jun 21, 2006
filing date -
Jun 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A filler for substrates which comprises an inorganic substance and a carbodiimide-group-containing organic layer chemically bonded to the surface of the inorganic substance. Examples of the carbodiimide-group-containing organic layer include a layer comprising a carbodiimide-group-containing compound represented by either of the following formulae. Due to the constitution, the filler for substrates can be highly dispersed in a resin for substrates even when added in a high proportion and can give a substrate inhibited from deteriorating in electrical properties, mechanical properties, etc. (1) (2)each independently represents hydrogen, halogeno, etc.; Z′s each independently represents silicon or titanium; A represents an organic group having a valence of 2 or higher containing a bond derived from an isocyanate group; m and 1 each is an integer of 1-3, provided that m+1=4; and n is an integer of 1-100.]
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