Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
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United States of America Patent
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app pub date -
Feb 23, 2010
filing date -
Jan 25, 2005
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Abandoned
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Abstract
The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups:wherein A is an epoxy compound residue and n is an integer of 1 or more.
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