LASER WELDING METHOD

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United States of America Patent

APP PUB NO 20100224601A1
SERIAL NO

12429209

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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When a laser beam is incident on a thin film, carbide generated by the heat of the beam is not ejected between respective metallic thin plates. In each of second conductive sections of a metallic thin plate, a slit extends from a welding position to the end of the second conductive section. The second conductive sections are respectively welded to terminals by making the laser beam incident on the respective welding positions of a substrate for the thin film. Thereby, when the beam is incident on a resin, the resin is carbonized by the thermal energy of the laser beam and the resin carbide is ejected from the welded portion, and the carbide is discharged to the outside from the lower end of the second conductive section via the slit of the second conductive section. Thereby, the carbide is not ejected between the adjacent second conductive sections. Consequently, lowering of the insulation resistance between the respective second conductive sections due to the carbide is prevented.

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Patent Owner(s)

Patent OwnerAddress
IRISO ELECTRONICS CO LTD2-13-8 SHINYOKOHAMA KOHOKU-KU YOKOHAMA-SHI KANAGAWA 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Saito, Tomomitsu Kanagawa, JP 7 34
Sugaya, Yujiro Kanagawa, JP 6 8

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