MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS
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United States of America Patent
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Issued Date -
Sep 9, 2010
app pub date -
Mar 5, 2009
filing date -
Mar 5, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.
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